Evans Analytical Group® (EAG) services
ATE Test & Engineering
EAG provides right sized services and brings you the resources, tools, instruments and the talents of a test engineering staff that will help you resolve your integrated circuit challenges; achieve your goals and meet your deadlines. We can provide a limited scope project or a full turn key solution where we analyze a data sheet and provide a full test planOur wide range of ATE test equipment and experienced team can support first silicon debug to release to high volume production for a wide range of products, from Digital to RF, including wafer sort and packaged part testing. Test platforms include Verigy, Teradyne, Advantest.
Advanced Microscopy
The Microscopy group includes staff and equipment to perform FESEM (Field Emission Scanning Electron Microscopy), which is used for surface structural and cross-sectional analysis. EDX (Energy Dispersive X-Ray Spectroscopy) is used to perform Elemental materials analysis, both qualitative and quantitative. FETEM (Field Emission Transmission Electron Microscopy) is used to perform microanalysis with sub-nanometer spatial resolution
SIMSview: SIMS Data Processing Software
Evans Analytical Group® (EAG) strives to provide our customers with extra value through exclusive features, such as our SIMSview data viewing and processing software for SIMS data. You can change the graph appearance, overlay files, and print or export the results, all within a few minutes. When used with our proprietary "svw" SIMSview data file format, this software allows you to:
Thermocouple Fabrication Services
Our thermocouple laboratories in Austin, TX and Phoenix, AZ have been providing high quality profile and spike thermocouple assemblies to customers around the world for over 30 years. With more than 20 years average technical experience in thermocouple design, fabrication and calibration, we supply OEM quality certified thermocouple assemblies for some of the most demanding applications. Services Include: Profile & Spike Thermocouple (TC) Assemblies, Epitaxial Thermocouples, NIST Traceable Calibration Certification, Base & Noble Metal TC Probes, OEM Replacements, Custom Designs, Individual or Bulk Quantities, International Services Available.
ESD Testing & Latch-Up Testing Services
EAG is an industry leader in ESD testing (Electrostatic Discharge) and Latch up testing. Our highly experienced engineering team use their industry leading knowledge and years or real world experience of the latest semiconductor technologies, circuit design, and device physics to optimize our customer"s ESD and latch-up results. When you choose EAG, you will be working together with recognized experts in the field of ESD testing and latch-up testing. ESD/LU worksheet requestWe are committed to providing our customers with the most up-to-date testing methodologies, along with technical interpretation of the test data and accurate assessment of the results.
Burn-In & Reliability Qualification Services
Reliability qualification demonstrates the fitness of a microelectronic product for use in the field and helps our clients better understand the fundamental wear-out mechanisms, detect design marginality combined with parameter drift and determine failure rates due to latent manufacturing defects.
PCB Design & Assembly Services
PCB Design uses state of the art design tools to include auto route and quickly design the most complex PCB`s in the industry. With our seasoned veterans, we`ll assist you with every step of the way in concept, layout, test, and development of your hardware. Every PCB design involves layout, application test engineer, and project manager to ensure the design is done correctly the first time.