MacDermid Alpha Electronics Solutions products

The ENTEK Organic Solderability Preservative (OSP) brand is the industry’s most trusted and widely used on the market today! ENTEK PLUS IC is the latest addition to the ENTEK OSP family, providing performance and yield improvement for substrate manufacturers. ENTEK PLUS IC’s industry leading thickness capability allows unrivalled shelf life of 24 months, providing supply chain flexibility and performance risk elimination associated with other OSP’s. With proven resistance to de-flux materials, ENTEK PLUS IC OSP maintains thickness through cleaning operations, delivering reliable performance for subsequent assembly operations ensuring yield maximization.

Widely specified immersion tin final finishes for consistent reliability. Our immersion tin processes represent the pinnacle of trusted reliability for tin metal final finishes in the automotive electronics segment and beyond. Whether you are building boards for press fit technologies, backplanes, or fine pitch applications, the ORMECON® and MacStan HSR processes can deliver excellent and consistent results that can be counted on to protect board surfaces before and during assembly operations.