MacDermid Alpha Electronics Solutions products

ALPHA OM-535 was developed with the aim to improve the solder joint performance, both for drop shock and thermal cycling, versus the existing low temperature products on the market. The enhanced properties of low temperature SBX02 alloy combined with the advanced  chemistry performance of OM-535 enables  the formation of a better solder joint  by improving the mechanical performance and solder joint cosmetics using low temperature process settings.

ALPHA OM-353 is designed to meet market segments requiring ultra-fine feature applications. It has been tested to give excellent printing performance down to 180μm pad size.