Condenso - Model XC -Condensation Soldering System
Vapor phase soldering for high throughput. The CondensoX series is based on a well-conceived design, in particular with regard to the hermetically sealed process chamber. Without moving the PCB during the process, the CondensoXP combines vacuum profiling and temperature profiling into a single system. Since the PCBs are not moved during the process, any shifting of the components is virtually ruled out. This, as well as outstanding temperature profiling, reduces failure rates and improves total cost of ownership. In the case of the CondensoXP variant, the loading axis is laid out such that it’s suitable for hook up to an automated loading unit. The CondensoXP HS is equipped with a second loading axis for increased throughput. The process chamber can thus be reloaded while the workpiece carrier is being cooled down at the same time. This system is perfect for use in high-speed production lines.
CondensoXC loading concept
- Loading
- Soldering/Vacuum
- Cooling
- Unloading
Manual front loading
The CondensoXC is manually loaded with pre-assembled product carriers from the front on the operator’s side. In this way, the assemblies can be easily placed on and removed from the interchangeable product carriers. The product carrier is on a rail system to ensure full access to the working area. Assemblies up to 500 x 540mm (W x L) can be placed on the product carriers.
Gentle cooling
After the soldering process, the assembly is cooled to the desired temperature using convection. The bulkhead of the cooling zone is then opened automatically, and the product carrier can be withdrawn on a rail for easy unloading.