microPREP™ - Model 2.0 -High-Throughput Laser Based Microdiagnostics Sample Preparation

microPREP™ 2.0 enables high-volume sample preparation of metals, semiconductors, ceramics, and compound materials for microstructure diagnostics and failure analysis. The system can be used for a variety of semiconductor sample preparation applications, including in-plane geometries and bulk samples, cross-sections, box milling for diagnostics of electrical connections and 3D chip-level structures, and full line cuts for complex investigations of complete devices. microPREP™ 2.0 complements existing approaches to sample preparation such as FIB processing and is suited for SEM inspection of avanced packaging devices, X-ray microscopy, atom probe tomography, and micro mechanical testing.