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E-BeamModel F5113 -Lithography System

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Low-Cost, High Throughput EB Lithography Tool Supports Ultrafine Pattern Fabrication for Diverse Substrates. The F5113 is an electron-beam lithography system supporting 200mm and 3-inch through to 6-inch substrates, making it an optimal tool for processing advanced LSIs, compound semiconductor wafers, magnetic heads, smart power devices, photonics devices, MEMS, and other devices requiring ultrafine-pitch fabrication. The F5113`s character projection (CP) functionality offers high resolution, excellent pattern fidelity, and high throughput. High-speed pattern exposure with CP enables a broad range of applications, including materials R&D and evaluation. Advantest`s proprietary self-cleaning technology massively improves the stability of the electron beam used by the F5113, contributing to higher utilization ratios and lower customer running costs across the spectrum of applications.

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  • Can be easily adjusted to handle diverse substrates (inquire for details)
  • High accuracy, high throughput
  • Self-cleaning functionality
  • Supported Substrates: 200mm, 3-inch to 6-inch
  • Beam Acceleration Voltage: 50kV
  • Lithography Methods: CP, VSB
  • Reduction Ratio of CP Projection: 60x
  • Supported Nodes: 90nm and below (Smallest node supported varies by application. Inquire for details.)