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Sono-Tek Corporation
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  5. SonoFlux - Model 2000F - Stationary ...

SonoFlux - Model 2000F -Stationary Ultrasonic Spray Fluxing System

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Stationary ultrasonic spray fluxing system for low mix/dedicated lines with medium to high volume. No moving parts mean ultra-low maintenance and the highest reliability and is compatible in all major wave solder machines. All SonoFlux systems feature non-clogging, repeatable, low maintenance ultrasonic spray performance with up to 80% reduction in flux consumption.

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  • SPRAY ASSEMBLY DIMENSIONS:
  • 330mm (13”) configuration – 514.4mm W X 330.3mm L x 193.5mm H (20.25” W x 13” L x 7.62” H) or 610mm (24”) configuration – 514.4mm W X 610mm L x 193.5mm H (20.25” W x 24” L x 7.62” H)
  • PCB WIDTH RANGE: 50-330mm (2–13”) or 50-610mm (2-24”)
  • CONTROL: Backlit LCD PLC with menu-driven 17-key keypad and wheel encoder
  • FLUX DELIVERY: High precision gear pump
  • POWER REQUIREMENTS:
  • 110/120 VAC, 50/60 Hz or 220/240 VAC, 50/60 Hz
  • Single phase, 750 VA max
  • AIR: 483-1034 kPa (70-150 PSI) @ 85 LPM (3 CFM)
  • CERTIFICATION: CE
  • ULTRASONIC NOZZLE DESIGNS: High transfer dual jet design
  • Only a monthly clean up, even with rosin flux
  • High velocity flux transfer for maximum top-side fill
  • Uniform coverage
  • Reduction in flux consumption up to 80%
  • Non-clogging ultrasonic design
  • Elimination of thinner
  • Easy operation and maintenance
  • Compatibility with all fluxes
  • Deposition density control micrograms/inch
  • Single or dual nozzle configurations available


The 2000F is designed with a high transfer efficiency spray assembly and a closed spray chamber, to capture any rosin flux vapor in the environment.The system can either be installed internally in your wave solder machine, or can be available as a stand-alone unit, both with a variety of optional features.

Low maintenance and no operator intervention, are the primary features of the SonoFlux 2000F. Only a monthly cleaning is necessary (even with sticky rosin flux).

The system is also equipped with a high velocity flux transfer system, to help with PCBs that have difficulty with topside fill, such as those with thick back planes, tight lead-to-hole ratios, or contaminated components.