Axus Technology products

CMP Equipment

The G&P Technology POLI-400L was designed to provide flexible CMP process capability for applications where ease of use, reliability, and a compact design are essential. Capable of working with substrates with up to 150mm diameter, the POLI-400L offers configuration choices in carrier type, conditioner technology, pad profiling, process measurement and monitoring systems. The POLI-400L utilizes an intuitive touch-screen user interface and a robust PLC control system that includes the multiple process steps and detailed process controls that users expect. Reliability and flexibility is further enhanced by relying on manual single substrate loading. The G&P Technology POLI-400L delivers high-value performance and research capability in a package that is compact and economical.

CMP Equipment

The G&P Technology POLI-500 is used for the planarization of dielectric, conducting, and semiconductor thin films on silicon wafers and other substrate materials. This polishing tool is an excellent choice for processing 6” (150mm) and 8” (200mm) wafers. This tool is available in several different configurations depending upon the customer’s need for the carrier type, pad conditioning technology, pad profiling capability, and process measurement and monitoring control systems. In the tradition of all G & P Technology tools and equipment, the POLI-500 is a versatile and flexible process tool already chosen by R&D laboratories, university research centers, consumables suppliers, substrate manufacturers, and chip developers.

Wafer Grinders

Fully-Automatic Wafer Grinder

The model 7AA fully-automatic wafer grinder is an automated in-feed grinder capable of grinding wafers ranging from 75 to 150mm in diameter. The 7AA combines proven vertical down-feed grinding technology with force adaptive grinding. The 7AA lowers the diamond wheels onto the wafer limiting the total downforce that can be applied to the wafer to a predetermined maximum. This protects the machine, the diamond wheels, and your valuable product from being overstressed, yet allows the machine to grind at its maximum possible rate. The 7AA also uses closed loop thickness control to reduce thickness errors and eliminate regrinds. Through continuous monitoring the computer determines if the final thickness varies from the target thickness and adjusts the grind spindle position.

Wafer Grinder

The Strasbaugh 7AF wafer grinder is an advanced wafer grinding solution for semiconductor, data storage, SOI, LED, and a variety of R&D applications. The 7AF delivers high volume throughput with superior finish and thickness control. The force sensitive mechanics and advanced control system allows adaptive grinding that is determined by grinding wheel dynamics resulting in reduced sub-surface damage and increased product yield. The unique mechanical design of the 7AF includes two air bearing grind spindles and two air bearing work holding spindles to allow simultaneious course and fine grind steps. Each wafer remains on the same work spindle for both grind steps thus reducing wafer handling and increasing wafer throughput.

Wafer/Substrate Cleaners

Post-Cmp Cleaning Tool

The G&P Technology 412S post-CMP cleaning tool is popular with R & D laboratories and start-up organizations who need a high quality, simple to use, single brush box, stand-alone post CMP wafer cleaning tool . The G & P Technology 412S cleaner can be configured to use the same cleaning consumables set typically used on integrated CMP planarization tools. This cleaner provides a method for using cleaning recipes similar to those used on full scale integrated production tools. This makes technology transfer seamless and facilitates shorter time-to market requirements.