Axus Technology products

Wafer Grinders

Model Strasbaugh 7AA - Fully-Automatic Wafer Grinder

The model 7AA fully-automatic wafer grinder is an automated in-feed grinder capable of grinding wafers ranging from 75 to 150mm in diameter. The 7AA combines proven vertical down-feed grinding technology with force adaptive grinding. The 7AA lowers the diamond wheels onto the wafer limiting the total downforce that can be applied to the wafer to a predetermined maximum. This protects the machine, the diamond wheels, and your valuable product from being overstressed, yet allows the machine to grind at its maximum possible rate. The 7AA also uses closed loop thickness control to reduce thickness errors and eliminate regrinds. Through continuous monitoring the computer determines if the final thickness varies from the target thickness and adjusts the grind spindle position.

Model Strasbaugh 7AF - Wafer Grinder

The Strasbaugh 7AF wafer grinder is an advanced wafer grinding solution for semiconductor, data storage, SOI, LED, and a variety of R&D applications. The 7AF delivers high volume throughput with superior finish and thickness control. The force sensitive mechanics and advanced control system allows adaptive grinding that is determined by grinding wheel dynamics resulting in reduced sub-surface damage and increased product yield. The unique mechanical design of the 7AF includes two air bearing grind spindles and two air bearing work holding spindles to allow simultaneious course and fine grind steps. Each wafer remains on the same work spindle for both grind steps thus reducing wafer handling and increasing wafer throughput.