Axus Technology products

The G&P Technology POLI-400L was designed to provide flexible CMP process capability for applications where ease of use, reliability, and a compact design are essential. Capable of working with substrates with up to 150mm diameter, the POLI-400L offers configuration choices in carrier type, conditioner technology, pad profiling, process measurement and monitoring systems. The POLI-400L utilizes an intuitive touch-screen user interface and a robust PLC control system that includes the multiple process steps and detailed process controls that users expect. Reliability and flexibility is further enhanced by relying on manual single substrate loading. The G&P Technology POLI-400L delivers high-value performance and research capability in a package that is compact and economical.

The G&P Technology POLI-500 is used for the planarization of dielectric, conducting, and semiconductor thin films on silicon wafers and other substrate materials. This polishing tool is an excellent choice for processing 6” (150mm) and 8” (200mm) wafers. This tool is available in several different configurations depending upon the customer’s need for the carrier type, pad conditioning technology, pad profiling capability, and process measurement and monitoring control systems. In the tradition of all G & P Technology tools and equipment, the POLI-500 is a versatile and flexible process tool already chosen by R&D laboratories, university research centers, consumables suppliers, substrate manufacturers, and chip developers.