Korvus Technology Ltd products

The HEX Series of thin film deposition systems provide a versatile range of deposition options for your research and implementation applications. To get started, you’re welcome to purchase the base model and upgrade to higher-level components to suit your needs as necessary. These upgrades are modular and simple to install, which reduces system downtime and installation costs. The HEX Series includes the benchtop HEX and the larger HEX-L and HEX-XL Systems. (See “HEX vs HEX-L vs HEX-XL page). All systems come with turbomolecular pumps which allow for vacuum in the 10-6 to 10-7 mbar range. The benchtop HEX allows for sample sizes up to 100 mm, but also comes with a multi-sample holder that can accommodate several smaller samples simultaneously. The system contains many upgrade options, including a 300 l/s pump that can achieve a base vacuum pressure in reduced time frames.

The HEX Series by Korvus Technology exemplifies modular PVD systems tailored for different scales and requirements. The series comprises three variants: HEX, HEX-L, and HEX-XL. The HEX is a compact benchtop or rack-mounted system suitable for samples with a diameter up to 4 inches and supports up to three deposition sources. Its chamber volume, optionally stackable to 24 liters, caters to various deposition needs. The HEX-L features a mobile base stand and can handle larger 6-inch samples, offering enhanced flexibility with its 50-liter chamber volume and integration options like glovebox compatibility. For even greater sample dimensions, the HEX-XL can handle 12-inch samples with a substantial chamber volume up to 172 liters. It allows customization through various deposition sources, including advanced E-beam evaporators for ultra-thin films and RF/DC sputtering with SmCo magnets. These systems are designed to maintain precise control over deposition processes, ensuring reliable and uniform thin films for a multitude of applications.

Korvus Technology’s PVD cluster system provides a solution to make the thin film deposition process more flexible, cost-effective and efficient. Our HEX PVD systems are unique in their versatility. The highly modular design prioritises customisation and flexibility for manufacturers and researchers using thin film deposition. Staying true to our philosophy of flexibility and upgradability, the “HEX Cluster” from Korvus allows users to begin with a single HEX-L chamber, and then connect further HEX-L chambers later on for in-vacuum transfer of samples between them.

The integration of the HEX or HEX-L series into gloveboxes provides a pivotal solution for handling air-sensitive materials. Unlike traditional PVD systems that require the entire chamber to be housed within a glovebox, the HEX Series offers a unique modular approach. This design allows the PVD chamber to be integrated through the floor of the glovebox, freeing up significant space inside and reducing contamination risks. The inert environment within gloveboxes, typically filled with argon, is essential for sensitive substrate work involving organic materials or reactive metals like lithium. The positioning of the HEX Series' chamber panels beneath the glovebox facilitates easier chamber cleaning without introducing contaminants. Furthermore, this modular integration can be conducted anytime post-purchase, offering flexibility and adaptability to researchers who may need to modify their setups later.

The HEX Series PVD systems from Korvus Technology are designed to offer modular and versatile solutions for thin-film deposition. The series includes three options: HEX, HEX-L, and HEX-XL, each catering to different application needs. The HEX model serves as a compact, benchtop or rack-mounted system with a capacity to handle 4-inch sample diameters and offers up to three deposition sources. The HEX-L, mounted on a mobile base stand, accommodates 6-inch samples and provides a larger chamber volume with magnetron sputter sizes extending to 3-inch diameters. The HEX-XL is the largest in the series, designed for 12-inch samples with extensive chamber volume, supporting sputtering on up to 4-inch diameters. These systems are equipped with customizable source options including mini E-beam evaporators for sub-monolayer film deposition, RF/DC sputtering capabilities, and the ability to deposit a wide range of materials. The systems are built to achieve ultra-high vacuum conditions and integrate with glovebox setups for specialized application environments.